Renesas Electronics and Nevs Sign Strategic Partnership Agreement

Renesas Electronics Corporation (TSE: 6723, Renesas), a premier supplier of advanced semiconductor solutions, and National Electric Vehicle Sweden (Nevs) announced today the signing of a strategic partnership agreement. Utilizing Nevs 'Phoenix architecture technology for electric vehicles and Renesas' technologies for new energy vehicles, the companies will join forces on the development of various system solutions targeting China's new energy vehicle market.

National Electric Vehicle Sweden AB
National Electric Vehicle Sweden AB

In accordance with this newly established partnership, Renesas and nevs will officially launch the research and development (R&D) of electric vehicles and at the same time will embark on a joint project to develop business strategies for new energy vehicle market in China.

Xinxiang, 21 in Beijing, Chairman of the Supervisory Board, Kai Johan Jiang, Vice Chairman, Stefan Tilk, Board Member, Wang Weihang, as well as Shinichi Yoshioka, Vice President, Deputy General Manager of 2015st Solution Business Unit at Renesas Electronics Corporation attendance.

The focus of this partnership is to build advanced automotive electronics technologies. The companies will engage in the development of high-end automotive control systems for new energy vehicles. This includes R&D of motor drive systems, automotive information systems, ADAS (Advanced Driving Assistance System), and safety control systems, and will also extend to the development of such new automotive applications as cloud-connected systems.

By collaborating on the two ends of the automotive industry chain, Renesas and Nevs aims to lead the development of safe, secure, and eco-friendly intelligent automobiles for the new energy vehicle industry.

3 thoughts on "Renesas Electronics and Nevs Sign Strategic Partnership Agreement"

  • OK, I'll take the Chinese back

  • Noch'n Chinese umgf

    • Tokyo ... not Beijing. Rensas is a leading semiconductor company based in Japan.

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